StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, will feature its molded ceramic packages at two upcoming exhibitions in Boston: the IMAPS International Symposium on Microelectronics, September 29-30, Booth 312, and the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), October 12-13.
A molded ceramic package is a semiconductor enclosure made using glass-to-metal seal technology commonly known as a flatpack. Its molded sidewalls use alumina-filled glass, a crack-resistant material that electrically insulates the leads. The shape of the package is formed in molds at extremely high temperature, making the package capable of surviving temperatures more than 500 °C. The molded dielectric mix forms a mechanical/chemical bond with the metal components, creating hermetic joints. After assembly of the chip into the package, StratEdge’s molded ceramic packages (MC Series) are sealed with metal lids using gold-tin solder to meet MIL-STD fine and gross leak requirements and maintain a controlled internal atmosphere.
StratEdge’s MC Series offers more than 200 standard outlines, with selected configurations supporting RF and microwave operations up to 18 GHz. Packages can be supplied with straight leads for drop-in assembly or gull-wing leads for surface mounting. Lead designs can also be adapted to existing footprints.
For high-power devices, the standard ASTM F15 alloy base can be replaced with a copper composite or copper laminate base, including copper-molybdenum-copper (CMC). These thermally enhanced bases improve heat dissipation for devices such as gallium nitride (GaN) and gallium arsenide (GaAs), while retaining the benefits of hermetic packaging.
“Our MC Series packages give engineers a source for U.S.-manufactured flatpacks,” said Casey Krawiec, vice president of global sales at StratEdge. “The choice of base material and lead configuration allows us to address thermal and assembly needs while drawing on a broad selection of standard package outlines.”
For more information, call (858) 569-5000, email info@stratedge.com, or visit www.stratedge.com.
Photo: https://www.stratedge.com/molded-ceramic-gan-packaging.png
About StratEdge
StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. The StratEdge portfolio includes post-fired ceramic and lower-cost molded ceramic packages and die-on-tab (sub-mount) assembly services engineered for GaN, GaAs, and SiC devices in telecom/5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and harsh environments. Our facility in Poway, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.
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